Electronics Testing Services

At Suntronic, we understand that every product functions differently, so we create our testing approach accordingly. The following electronic testing capabilities that we have developed over the years have helped us stay true to our commitment to delivering quality products at competitive prices.

• Burn-in Testing: If requested by the Customer this type of testing enables us to check the performance of PCBs at high temperatures. It is generally performed on a small volume of PCBs, which are subjected to high temperatures. The data collected helps our engineers understand the product defects and make modifications that improve the product reliability before the PCB burns out. In short, this type of testing helps identify how your PCB will survive and last in real and live environments.  
• Flying Probe: This type of testing is an improvement of the bed of nails testing and requires no permanent fixture, which makes it inexpensive. A flying probe machine can access the ends of components or unintended vias as test points. The machine can be programmed to check the value of passive parts, their voltage measurements, and the transistor/diode orientation. In-circuit testing is suited for small and medium batch production, prototypes, and compact-sized boards with component density.
• In-circuit Testing: In-circuit testing is one of the robust types of testing, which is usually performed on a large volume of mature products. It is one of the most advanced forms of automated testing, which has a high fault coverage of 98%. Electric probes are used in the bed of nails to check shorts, open circuits, soldering defects, and incorrect orientation of transistors/diodes.
• X-Ray Inspection: As the name suggests, this type of testing is performed using X-rays. We employ X-ray systems capable of 2D and 3D inspection workflow. The X-ray inspection is ideal for inspecting hidden joints in underside pads and ball grid arrays (BGAs). The X-ray inspection helps detect solder voids and has one of the highest detection rates of faults, which are not otherwise detectable by inspection.
• Automated Optical Inspection (AOI): The automated optical inspection (AOI) uses 2D or 3D cameras to take images of the PCB. The image is compared with the images of PCB design being tested and the database of images of bad and good boards. The AOI machine can be integrated at the end of the production equipment. Automated Optical Inspection of PCBs helps detect major solder defects, and is suited for testing mature products in large batches.
• Design for Test (DFT): All electronic parts, products, and PCBs have a project development lifecycle, which comprises various steps such as ideation, design, analysis, prototyping, testing, manufacturing, assembling, and so on. Here, testing is performed mostly after every other stage such as design, manufacturing, and assembling. Here are some pointers regarding DFT.
  • Design for Testing or DFT is a technique which essentially prevents creation of designs which may be difficult to test well at any of the stages or may create compatibility issues at later stages.
  • DFT considers various aspects such as the functional feasibility and testability of a product or circuit board while it is being designed and developed. It helps reduce associated costs, time, and unnecessary design-related complexities.
  • At Suntronic Inc., we have a team of DFT experts and they are involved in the concerned project from the very beginning. They have brain stroming sessions with the design and development teams to come with the right design that meets all the client requirements. They help develop an approach which makes us think of the board or product from a testing perspective keeping the sustainability goals and client requirements intact.
  • Testing typically happens on two levels- at R&D stage which is verification and during production as well as assembling- which is validation.
  • Final testing is also done before the product is ready to be shipped out. This is done in terms of the overall structure, stability, environmental parameters, and basic functioning.
  • Just like DFM, it helps set the best practices of product development and testing, and hence should be implemented in the project right at the beginning.
  • This approach can be applied on interdependent designs in a project, wherein assemblies, subsystems, or interdevice components need to be integrated.