Available Services
- Rapid Prototyping PCB Assembly
- New Product Introduction
- Printed Circuit Board Assembly Services
- Cable and Wire Harness Assembly
- Box Build Assembly Services
- Repair and Refurbishment
- Supply Chain Management
- Low Pressure Injection over Molding
- Failure Analysis and Reliability
- Surface Mount Technology
- Electronics Contract Manufacturing Service
- Electronics Testing Services
- PCB Assembly Optical Inspection
- Electromechanical Assembly
- Through-Hole PCB Assembly
- Mixed Model Assembly Services
- High Volume PCB Assembly
- Low Volume PCB Assembly
- PCB Conformal Coating Services
- Selective Soldering
- Consumer Electronics Fulfillment Services
- Electronics Manufacturing Services
- SMT Stencils
- Turnkey PCB Assembly
- Consigned PCB Assembly
BGA Rework
The printed circuit boards are getting more complex in terms of designs and densities. Ball grid arrays or BGAs are small metallic solder balls that are placed on the printed circuit boards. These BGAs assure low track density, reliability and resistance, low thermal issues, and improved performance than quad flat package components. Designing and manufacturing these components require immense skills and knowledge. Similarly, BGA rework also requires knowledge, technical skills, and expertise. Suntronic offers circuit board repair services in the US, and BGA rework services are one of the key highlights of our service. Our vast experience in PCB assembly, rework, and state-of-the-art facility enables us to meet challenging requirements of BGA rework and repair.
Suntronic’s BGA Rework Services
At Suntronic, we can easily meet a wide range of BGA rework requirements that our clients may have. The following are some highlights of our rework services.
- Pad and Track Repair: The BGA pads and tracks may get damaged due to improper part removal, cleaning, and other reasons. We can repair these pads before reballing in scenarios where critical parts are involved. We stock a wide range of pads of various styles and kinds to assure the fastest turnaround times in pad and track repair.
- Solder Mask Repair: The solder mask areas near BGA pads get damaged due to component removal from them. Vias and circuits in these damaged areas are prone to shorting. Our experts are capable of tackling challenging solder mask repair and replacement that most other manufacturers cannot address.
- BGA Site Modification: Some projects may require component site modification of BGA, and this is usually achieved using jumper wires. BGA site modification is a procedure that demands a high level of expertise, and our experts perform it easily without extensively changing the part.
- Damaged or Missing BGA Pads: Damaged and missing pads are a common problem with BGAs. Our experts resolve this by using specially designed pads that are directly bonded to the surface. These pads have a strong adhesive backing to them.
- Component Removal and Replacement: This is one of the most challenging aspects of a BGA repair and rework service. The BGA components may feature more than 1000 balls at 1.0mm pitch. Thus, the removal and replacement of a component become too challenging. This is easily achieved by our experts at Suntronic.
BGA Assembly Capabilities | |
|---|---|
Item | Capacity |
Types of BGA PCB: | Micro Ball Grid Array (µBGA) |
Thin Chip Array Ball Grid Array (CTBGA) | |
Chip Array Ball Grid Array (CABGA)
| |
Very Thin Chip Array Ball Grid Array (CVBGA) | |
Very Fine Pitch Ball Grid Array (VFBGA) | |
Land Grid Array (LGA)
| |
Chip scale Package (CSP) | |
Wafer level chip scale packaging (WLCSP) | |
BGA Assembly size:
| Sizes range from 2mm x 3mm/1x1mm to 45mm/50x50mm.
|
BGA PCB testing protocols:
| X-ray inspection
|
Functional Testing | |
Automated Optical Inspection | |
BGA rework:
| |
Pad and Trace Repair (If customer design allows) | |
Solder Mask Repair | |
Damaged or Missing BGA pads | |
Component Removal and replacement | |
Pitch Sizes | The BGA components may feature more than 1000 balls at 1.0mm pitch |
Benefits of Partnering with Suntronic for Circuit Board Repair Services
Being a leading electronics contract manufacturer (ECM), we have had the privilege of working with clients from diverse industries. We believe the benefits that clients derive from our services prompt them to approach us with their diverse fabrication and reworking needs. The following features of our services are widely appreciated by clients.
- BGA rework consulting is one of the key highlights of our services. Our experts will carefully review your BGA to identify the areas that may require repair and rework.
- In many cases, clients may be aware of only a few areas of reworking, while our BGA rework consulting allows them to identify the other affected areas.
- All BGA rework is performed at any of our well-equipped facilities in Houston, Austin, and Dallas.
- All circuit board repair tasks are handled by certified experts with vast experience to their credit. We use proven techniques and tools to assure cost-efficient BGA rework services.
- We always prioritize customers before anything else. Our experts always pay attention to detail that helps us solve several critical rework challenges with ease. Our high-level customer service helps us assure effective results of PCB rework.
Feel free to contact us for more information on our PCB repair and rework capabilities on our email id or phone numbers displayed on this page. Our experts would be happy to answer your queries.